Aaronn Electronic GmbH

28/05/2026

Choosing the right embedded architecture can significantly impact the scalability and long-term maintainability of an industrial system.

One of the most important decisions in embedded design is whether to use a Computer-on-Module (COM) or a System-on-Module (SOM).

COMs are typically modular and standardized, making them ideal for scalable industrial systems that require future upgrades and long product lifecycles.

SOMs are often more compact and application-specific, which can be advantageous for tightly integrated embedded devices.

In Aaronn’s COMs White Paper, we explain the differences between COMs, SOMs, and full custom embedded architectures — and where each approach makes the most sense.

Read the white paper here:

Schneller entwickeln, flexibel skalieren und Zukunftssicherheit durch COM Express, COM-HPC, SMARC & Co. Erfahren Sie mehr bei Aaronn.

26/05/2026

𝗔𝗥𝗠-𝗕𝗮𝘀𝗲𝗱 𝗘𝗱𝗴𝗲 𝗔𝗜 𝗶𝗻 𝗖𝗢𝗠-𝗛𝗣𝗖 𝗠𝗶𝗻𝗶

Industrial AI applications require reliable performance, real-time data processing, and scalable system design. The congatec conga-HPC/mIQ-X delivers heterogeneous ARM computing in a compact COM-HPC Mini module, supporting demanding edge workloads in automation and intelligent systems.

💡 𝗛𝗶𝗴𝗵𝗹𝗶𝗴𝗵𝘁 𝗙𝗲𝗮𝘁𝘂𝗿𝗲𝘀
▪️ Up to 12 Oryon CPU cores + 45 TOPS NPU
▪️ PCIe Gen4, USB4, dual 2.5GbE
▪️ LPDDR5x up to 64GB, UFS 4.0
▪️ -40°C to +85°C industrial operation
▪️ Designed for vision, robotics & edge gateways

🔗 Learn more: https://www.aaronn.de/blog/skalierbare-arm-performance-im-com-hpc-mini-format/
🔗 Product at Aaronn: https://www.aaronn.de/produkte/board-level/computer-on-modules/com-hpc/conga-hpc-miq-x/

22/05/2026

Modern industrial systems are evolving beyond traditional desktop PC architectures.

Industrial applications today require:
- Long-term availability
- Scalable performance
- Compact and reliable designs
- Easier hardware upgrades
- Support for edge AI and connected systems

This is why many companies are moving toward modular embedded platforms based on Computer-on-Modules (COMs).

COM-based architectures allow the computing layer to be upgraded independently from the rest of the system, helping reduce redesign effort and improve long-term maintainability.

Aaronn Electronic supports customers in designing scalable embedded architectures for industrial and IoT projects.

Learn more here: https://www.aaronn.de/erfolgreiche-digitalisierungsprojekte-mit-computer-on-modules-coms

Schneller entwickeln, flexibel skalieren und Zukunftssicherheit durch COM Express, COM-HPC, SMARC & Co. Erfahren Sie mehr bei Aaronn.

21/05/2026

📖 Digitalization in industrial environments depends on more than software alone.

Modern production systems, robotics platforms, medical technology, and edge AI applications all require reliable embedded computing architectures that can scale over time.

Computer-on-Modules (COMs) have become an important foundation for these systems because they offer flexibility, long-term maintainability, and easier hardware upgrades.

In Aaronn’s COMs White Paper, we explain:

- What COMs are
- Why they matter in industrial digitalization
- The most important COM standards
- How companies can build future-proof embedded systems

🔗 Read the white paper here: https://www.aaronn.de/erfolgreiche-digitalisierungsprojekte-mit-computer-on-modules-coms/

20/05/2026

Excited to attend the Intel Edge Platforms and Technologies Summit 2026 in Munich today.

Looking forward to technology updates and discussions around lthe future of Edge AI.

Thanks for the invitation. 🙌🏻

EmbeddedIoT

19/05/2026

📢 𝗰𝗼𝗻𝗴𝗮𝘁𝗲𝗰 𝗰𝗼𝗻𝗴𝗮-𝗧𝗖𝟯𝟬𝟬: 𝗘𝗱𝗴𝗲 𝗔𝗜 𝗳𝗼𝗿 𝗜𝗻𝗱𝘂𝘀𝘁𝗿𝗶𝗮𝗹 𝗔𝗽𝗽𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻𝘀

Industrial systems are moving toward local intelligence, efficient power usage, and scalable compute within compact embedded designs. The conga-TC300 supports this shift with COM Express flexibility and integrated AI acceleration for robotics, automation, and more.

💡𝗛𝗶𝗴𝗵𝗹𝗶𝗴𝗵𝘁 𝗙𝗲𝗮𝘁𝘂𝗿𝗲𝘀
▪️ Intel Core Series 3 with up to 41 TOPS AI performance
▪️ Dedicated NPU + Xe3 graphics for edge AI workloads
▪️ COM Express Compact form factor
▪️ Up to 64 GB DDR5 memory and flexible I/O
▪️ Robotics, medical, transportation & automation use cases

🔗 Learn more: https: https://www.aaronn.de/blog/conga-tc300-fuer-skalierbare-edge-ki-plattformen/
🔗 Product at Aaronn: https://www.aaronn.de/produkte/board-level/computer-on-modules/com-express/conga-tc300/

12/05/2026

📢 𝗔𝗗𝗟𝗜𝗡𝗞 𝗘𝗱𝗴𝗲 𝗔𝗜 𝗣𝗹𝗮𝘁𝗳𝗼𝗿𝗺𝘀 𝗔𝗱𝘃𝗮𝗻𝗰𝗲 𝗜𝗻𝗱𝘂𝘀𝘁𝗿𝗶𝗮𝗹 𝗔𝗜 & 𝗠𝗲𝗱𝗶𝗰𝗮𝗹 𝗜𝗺𝗮𝗴𝗶𝗻𝗴 𝘄𝗶𝘁𝗵 𝗛𝗶𝗴𝗵-𝗣𝗲𝗿𝗳𝗼𝗿𝗺𝗮𝗻𝗰𝗲 𝗘𝗱𝗴𝗲 𝗖𝗼𝗺𝗽𝘂𝘁𝗶𝗻𝗴
The DLAP-IGX and DLAP-701 platforms deliver scalable AI performance, high-bandwidth connectivity, and reliable deployment for data-intensive environments.

💡𝗛𝗶𝗴𝗵𝗹𝗶𝗴𝗵𝘁 𝗙𝗲𝗮𝘁𝘂𝗿𝗲𝘀
▪️ DLAP-IGX powered by NVIDIA IGX T7000 with up to 4,293 TFLOPS AI performance
▪️ DLAP-701 supports NVIDIA Jetson T5000/T4000 with up to 128GB LPDDR5X memory
▪️ High-speed networking with QSFP and NVIDIA ConnectX-7 SmartNIC support
▪️ Designed for industrial AI, medical imaging, and autonomous edge applications

🔗 DLAP-IGX at Aaronn: https://www.aaronn.de/produkte/system-level/embedded-box-pcs/edge-ai-pcs/dlap-igx/
🔗 DLAP-701 at Aaronn: https://www.aaronn.de/produkte/system-level/embedded-box-pcs/edge-ai-pcs/dlap-701/

07/05/2026

📖 𝗖𝗼𝗺𝗽𝘂𝘁𝗲𝗿-𝗼𝗻-𝗠𝗼𝗱𝘂𝗹𝗲𝘀: 𝗧𝗵𝗲 𝗕𝗮𝗰𝗸𝗯𝗼𝗻𝗲 𝗼𝗳 𝗦𝗰𝗮𝗹𝗮𝗯𝗹𝗲 𝗗𝗶𝗴𝗶𝘁𝗮𝗹𝗶𝘇𝗮𝘁𝗶𝗼𝗻

From industrial automation to medical technology and Edge AI, embedded systems must be flexible, scalable, and built for long-term use.

Computer-on-Modules (COMs) make this possible — enabling faster development, easier upgrades, and reduced system complexity.

As a vendor-independent system integrator, Aaronn supports your project from concept to series production, including module selection, carrier board design, and lifecyclemanagement.

👉 Learn more: https://www.aaronn.de/erfolgreiche-digitalisierungsprojekte-mit-computer-on-modules-coms/

🔗 COM portfolio: https://www.aaronn.de/produkte/board-level/computer-on-modules/

05/05/2026

💻 Industrial computing is shifting—from centralized systems to the edge.

Embedded Box PCs are at the heart of this transformation.

They process data locally, enable real-time insights, and support reliable 24/7 operations in demanding environments.

However, one common challenge remains:
System selection is often treated as a hardware decision—when in reality, it’s much more complex.

Choosing the right solution means aligning:
• Environment & durability
• Interfaces & connectivity
• Performance & scalability
• Lifecycle & long-term support

With the rise of Edge AI, IIoT, and increasing security requirements, getting this right from the beginning is critical.

📖 Learn more: https://www.aaronn.de/embedded-box-pcs-im-industriellen-einsatz/

30/04/2026

⚡ 𝗔𝗱𝘃𝗮𝗻𝘁𝗲𝗰𝗵 𝗔𝗥𝗞-𝟯𝟱𝟯𝟱 – 𝗕𝘂𝗶𝗹𝘁 𝗳𝗼𝗿 𝗩𝗶𝘀𝗶𝗼𝗻 & 𝗔𝘂𝘁𝗼𝗺𝗮𝘁𝗶𝗼𝗻

When space is limited but workloads grow, ARK-3535 delivers strong AI computing and industrial-grade reliability for continuous operation.

▪️ AMD Ryzen™ Embedded platform
▪️ Up to 38 TOPS acceleration
▪️ Triple display support
▪️ 4x LAN + serial connectivity
▪️ Fanless wide-temp design

Scale your edge system with Aaronn.

🔗 Product: https://www.aaronn.de/produkte/system-level/embedded-box-pcs/leistungsstarke-embedded-pcs/ark-3535/

28/04/2026

Reliable performance for harsh environments starts with the right module platform. congatec COM solutions combine Intel Panther Lake processing, rugged design, and scalable form factors for industrial automation, robotics, medical systems, and transport.

💡 Highlight Features
▪️ Up to 180 TOPS for Edge AI
▪️ COM-HPC & COM Express options
▪️ -40 °C to +85 °C operation
▪️ High I/O bandwidth for demanding workloads

Discover the right solution with Aaronn today.

🔗 Learn more: https://www.aaronn.de/blog/congatec-computer-on-modules-fuer-robuste-edge-systeme/
🔗 COM-HPC at Aaronn: https://www.aaronn.de/produkte/board-level/computer-on-modules/com-hpc/
🔗 COM Express at Aaronn: https://www.aaronn.de/produkte/board-level/computer-on-modules/com-express/