04/28/2026
Join the Dukane team at INDEX™ 2026 to explore how ultrasonic bonding technology is transforming elastic attachment in hygiene product manufacturing.
Dukane’s Full Panel iQ RAM Ultrasonic Bonding Module enables manufacturers to bond elastics directly to nonwoven materials without adhesives, preserving the elastic's natural stretch and recovery properties.
Using ultrasonic bonding for elastic attachment helps manufacturers:
• Maintain elastic stretch and recovery performance
• Eliminate adhesive usage and reduce consumables
• Achieve clean, precise bond patterns
• Deliver consistent bonding at high production speeds
Designed for continuous, high-speed converting lines, the iQ RAM Module delivers reliable bonding performance while enabling more efficient, sustainable manufacturing of hygiene products.
Meet our team at INDEX™ 2026 at Booth 1568 to see Dukane’s ultrasonic bonding technology in action.